- Ganapathi Bharathi,
- Devaraj Nataraj,
- Sellan Premkumar,
- Murugaiyan Sowmiya,
- Kittusamy Senthilkumar,
- T. Daniel Thangadurai,
- Oleg Yu Khyzhun,
- Mukul Gupta,
- Deodatta Phase,
- Nirmalendu Patra,
- Shambhu Nath Jha &
- Dibyendu Bhattacharyya
https://www.nature.com/articles/s41598-017-10534-4
Graphene has been studied intensively in opto-electronics, and its transport properties are well established. However, efforts to induce intrinsic optical properties are still in progress. Herein, we report the production of micron-sized sheets by interconnecting graphene quantum dots (GQDs), which are termed ‘GQD solid sheets’, with intrinsic absorption and emission properties. Since a GQD solid sheet is an interconnected QD system, it possesses the optical properties of GQDs. Metal atoms that interconnect the GQDs in the bottom-up hydrothermal growth process, induce the semiconducting behaviour in the GQD solid sheets. X-ray absorption measurements and quantum chemical calculations provide clear evidence for the metal-mediated growth process. The as-grown graphene quantum dot solids undergo a Forster Resonance Energy Transfer (FRET) interaction with GQDs to exhibit an unconventional 36% photoluminescence (PL) quantum yield in the blue region at 440 nm. A high-magnitude photocurrent was also induced in graphene quantum dot solid sheets by the energy transfer process.
USPTO Applicaton #: #20160351490 Inventors: Mukul Gupta, Xiangdong Chen, Ohsang Kwon
http://www.freshpatents.com/-dt20161201ptan20160351490.php
A MOS device includes first, second, third, and fourth interconnects. The first interconnect extends on a first track in a first direction. The first interconnect is configured in a metal layer. The second interconnect extends on the first track in the first direction. The second interconnect is configured in the metal layer. The third interconnect extends on a second track in the first direction. The third interconnect is configured in the metal layer. The second track is parallel to the first track. The third interconnect is coupled to the second interconnect. The second and third interconnects are configured to provide a first signal. The fourth interconnect extends on the second track in the first direction. The fourth interconnect is configured in the metal layer. The fourth interconnect is coupled to the first interconnect. The first and fourth interconnects are configured to provide a second signal different than the first signal.
