European researchers claim terahertz breakthrough

Ben Vogel, London - IHS Jane's Airport Review

http://www.ihsairport360.com/article/7576/european-researchers-claim-terahertz-breakthrough

A consortium of researchers from industry and academia has developed a low-cost, accurate terahertz imaging system for multiple applications, including aviation security screening.

The four-year, EUR3.15 million (USD3.55 million) TeraTOP programme was funded by the European Commission in its 7th Framework Programme (FP7).

Researchers built and successfully tested a demonstrator system, comprising a 24x24 focal plane array of detectors and readout circuitry operating in video imaging mode.

Earlier research into the aviation security applications of terahertz systems, operating in the 0.3-10 THz frequency range, encountered obstacles related to a lack of devices and circuits suitable for mass production and the need for extensive cooling during use; but TeraTOP partners believe they have created a solution to these problems, as their system uses a terahertz imaging device with complementary metal oxide semiconductor (CMOS) technology.

CMOSs are widely used in computer processors and mobile phone camera chips, so integrating the technology into a terahertz screening system should cut production overheads while also improving performance.

This is because the demonstration system developed under TeraTOP functions in the 0.5-1.5 THz range, using a specially developed terahertz sensor that operates at room temperature. In contrast, other terahertz-based systems need costly cryogenic cooling to under -200°C.

TERATOP PARTNERS

The eight-strong TeraTOP consortium included: Centre Suisse d'Electronique et de Microtechnique of Switzerland (Switzerland - co-ordinator); Airbus Group Innovations (Germany - formerly EADS Innovation Works, including EADS Deutschland); CEA-LETI (France); IBM Research - Haifa (Israel); IBM Research (Switzerland); QMC Instruments (UK); Technion Israel Institute of Technology (Israel); and the University of Wuppertal (Germany).

Airbus : Innovations And Research Partners Make Breakthrough In Terahertz Imaging Technology

http://www.4-traders.com/AIRBUS-GROUP-4637/news/Airbus-Innovations-And-Research-Partners-Make-Breakthrough-In-Terahertz-Imaging-Technology-21593984/

Airbus Group Innovations, together with seven research partners, has made an important breakthrough in terahertz imaging technology which offers strong potential in the areas of space observation, medical imaging, industrial automation and security screening. Under the auspices of a European Union project called TeraTOP, consortium partners developed a new camera that delivers high accuracy using terahertz waves and promises lower production and operating costs.
Terahertz frequencies - which correspond to 300 gigahertz to 10 terahertz - occupy a section of the electromagnetic spectrum between the microwave and the optical. When used for security screening applications, for example, terahertz imagers provide higher-resolution images than existing millimetre wave imagers. But while the use of other parts of the electromagnetic spectrum - from X-rays to millimetre waves - is ubiquitous in today's imaging technology, the terahertz frequency remains mostly underutilised despite decades of research. That's because existing applications tend to have complex manufacturing processes and require extensive cooling during operation - resulting in prohibitively high production and operating costs and correspondingly low market demand.
TeraTOP was launched in 2011 and successfully tackled both technological and cost issues over the course of the 45-month project: The new camera is based on technology that has the potential to significantly lower production costs and enable future mass production of terahertz cameras and imagers - a big step forward in advancing the commercial use of terahertz technology for imaging in the future. Key to TeraTOP's research was determining an appropriate strategy for developing and producing a terahertz imaging device with complementary metal oxide semiconductor (CMOS) technology. As CMOS technology is widely used today in computer processors and mobile phone camera chips, it promises the reduction of production costs as well as improvements in performance.
Recent developments in the field of electronic imaging based on CMOS technology have generated enormous business opportunities worldwide. Today's imaging technologies almost solely detect the visible and near-infrared part of the electromagnetic spectrum. So far, the development of analogous capabilities in the terahertz range (0.3 THz - 3.0 THz) has focused primarily on exotic materials and has been impeded by the lack of devices and circuits suitable for mass production. The new chip-integrated camera (0.5 -1.5 THz) is expected to expand the fields of application, and uses a completely new type of terahertz sensor that enables operation at room temperature. This gives it a clear advantage over terahertz sensors that normally require expensive cryogenic cooling to temperatures below minus 200°C to perform well.
The blend of advanced technologies for this new camera led to improvements in thermal sensitivity and high-level integration of terahertz components. A demonstrator, comprising a 24x24 focal-plane-array (FPA) of detectors and readout circuitry operating in video imaging mode, was built, and its full functionality successfully tested.
The current camera design is suited for active terahertz imaging. Further development of CMOS-based terahertz technologies is expected to enhance sensitivity and also enable passive imaging applications.

About TeraTOP
TeraTOP is a consortium consisting of eight European industry and academic partners, and was assembled in 2011 under the auspices of a 45-month long project to address the technological gap in terahertz technology imaging by developing the first terahertz photonic imager on chip. The project was funded by the European Union's EU-FP7 framework programme (Grant agreement no.: 288442) and had a total budget of € 3.15 million. TeraTOP was coordinated by CSEM (Switzerland) and consisted of: Airbus Group Innovations (Germany), Technion Israel Institute of Technology (Israel), IBM Research - Haifa (Israel), IBM Research GmbH (Switzerland), CEA-LETI (France), the University of Wuppertal (Germany), CSEM (Switzerland) and QMC Instruments Ltd. (U.K.). Additional leading experts in the field of terahertz technology formed an external advisory board to assist the consortium. Further information on TeraTOP is available at www.teratop.eu

About Airbus Group
Airbus Group is a global leader in aeronautics, space and related services. In 2014, the Group - comprising Airbus, Airbus Defence and Space and Airbus Helicopters - generated revenues of € 60.7 billion and employed a workforce of around 138,600. Further information on Airbus Group and Airbus Group Innovations is available at www.airbusgroup.com

Airbus Group NV issued this content on 2015-12-22 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 2015-12-22 13:06:47 UTC
Original Document: http://www.airbusgroup.com/int/en/news-media/press-releases/Airbus-Group/Financial_Communication/2015/12/20151222_airbus_group_terahertz_

Checking in on TeraTop

TeraTOP

Terahertz Photonic Imager on Chip

My Note: I try to keep an eye on developments at TeraTop,  by checking their webpage intermittently. The last news article posted references a project meeting to be held last February, but  nothing has been posted since then (which is accessible to the public at least). The lofty goals of TeraTop,  are identified on the webpage below.
 I note that Darpa, is also working in this area, and is getting closer to the development of a solid state THz chip operating at frequencies above 1 THz, and it will be interesting to see if TeraTop can reach the 1.5 THz range by project close in 2014.  
http://www.teratop.eu/node/1

The impressive developments in the field of electronic imaging based on CMOS Imagers have generated worldwide enormous business opportunities, with revenues of more than $4B in 2009 at the component level alone. Today such Imagers almost solely address the visible and near-infrared part of the electromagnetic spectrum. Many applications would profit from affordable and reliable Imagers for the terahertz band, notably in surveillance and security.
The goal of TeraTOP is to develop a new high performance, low cost, THz Imager for passive imaging systems (0.5-1.5THz) based on CMOS batch manufacturing processes: A unique combination of several leading technologies will enable a real quantum leap in THz Imaging in terms of performance, size and costs. THz photonics components (THz lens, optical window and filters), THz antennas, CMOS-SOI (Silicon on Insulator) and NEMS are the key enabling building blocks that will be developed and combined to achieve such a breakthrough in functionality (passive, room temperature operation), performance (NETD of 0.5K), component size (THz imager on a chip) and significant cost reduction (< 7000 €).
The objective is to bring the disruptive technology from the research lab closer to applications, by developing a passive THz Imager for Concealed Weapons Detection. The cost efficient approach will enable a massive deployment of the TeraTOP Imagers, including crowded places, providing therefore a highly efficient response to terrorists' threats. Other applications can be envisioned in medical imaging e.g. skin cancer detection, or astronomy.
The consortium includes a mix of scientific and technological excellence (University of Wuppertal, the IIT, CEA-Léti), as well as leading industrial research groups (IBM, CSEM) and companies (EADS, QMC). The exploitation activities will be led by the key European industrial partner EADS. This will ensure that the project will target the current security needs and the results will lead to product development and promptly implemented on a wide scale across Europe for the benefit of its citizens.

Revisiting TeraTop-TeraTOP Aims to Revolutionize THz Imaging

My Note: With the recent stories and interest in CMOS, I came across this article from November of  last year, that I hadn't posted here, and thought it was worth sharing now.
http://www.photonics.com/Article.aspx?AID=49244
ZURICH, Nov. 28, 2011 — A true on-chip integrated camera under development will allow wider use of terahertz imaging technology for airline and other security operations. The main objective of the program — dubbed TeraTOP — is to develop a device that can reduce the cost and improve the capability of terahertz imaging in various applications. The consortium of European industrial research groups and companies making the device will focus on potential security applications and will demonstrate a camera for detecting hidden objects.

The TeraTOP consortium plans to implement a completely new type of terahertz sensor based on thermally isolated nanotransistors directly integrated with CMOS-SOI (silicon-on-insulator) readout circuitry. The key target of the project is to make breakthrough advances in the functionality, performance, cost and size of a passive terahertz camera. The target technology is a room-temperature real-time imaging system based on CMOS batch manufacturing processes that are suitable for mass production. Success depends on the effective combination of several leading technologies from the broad scientific background represented by the consortium’s members. The key enabling building blocks include the following: terahertz photonic components, terahertz antennas, CMOS-SOI, nanoelectromechanical systems and frequency-selection technologies from the astronomy community.

TeraTOP intends to build on the knowledge and experience gained during previous projects. Infrared imaging sensors based on CMOS-SOI-microelectromechanical systems technology have been developed before. However, significant advances are to be expected from this new initiative if the TeraTOP team is to achieve its goals. Underlying the project are several important THz-related patents and patent applications submitted by two of the project partners: Technion (Israel Institute of Technology) and IBM Haifa Research Labs. The TeraTOP project hopes for a significant product that can be implemented rapidly on a broad scale across Europe.

TeraTOP is a three-year project funded by the European Commission’s Seventh Framework. With a total budget of €3.15 million, it is led by Nicolas Blanc of Centre Suisse d’Electronique et de Microtechnique SA (CSEM, the Swiss Center for Electronics and Microtechnology). The consortium consists of CSEM, Technion, IBM Haifa Research Labs, IBM Research GmbH in Switzerland, CEA-LETI of France, the University of Wuppertal in Germany, EADS Deutschland GmbH of Germany, and QMC Instruments Ltd. in the UK. Additional leading experts in the field of THz technology will form an external advisory board to assist the consortium.

For more information, visit: www.teratop.eu

TeraTOP- focus on CSEM, Centre Suisse d'Electronique et de Microtechnique

General description

CSEM, Centre Suisse d'Electronique et de Microtechnique, founded in 1984, is a private R&D center specialized in micro- and nanotechnology, system engineering, micro- and optoelectronics, as well as communications technologies. CSEM has more than 400 employees in Switzerland and 54M€ in revenues (2009). In the field of electronic imaging and integrated circuits CSEM is focused on the development of low-power ICs, imaging systems of ultimate performance, and imagers with on chip and pixel-level signal-processing functionality. Specific know-how embraces thorough knowledge of semiconductor physics and devices, analogue and mixed-signal circuit design, analogue and digital control electronics for image sensors, as well as firmware, algorithmic, software, optics and system engineering for photo detector systems.

Role / activity in the project

CSEM is the coordinator of the TeraTOP project. In addition, CSEM will lead the WP4 on the development and characterization of the low-noise readout circuit (ROIC) of the Terahertz imaging detector.

People involved in the project

Nicolas Blanc, received his PhD in Physics in 1992 from the EPFL in Lausanne, Switzerland. He also holds an executive MBA from the RH Smith School of Business of the University of Maryland (USA). He worked in the field of Nanodevices at IBM Zurich Research Laboratory and in MEMS at the Institute of Microtechnology at the University of Neuchâtel, Switzerland. In 1996 he joined the Paul Scherrer Institute in Zürich, Switzerland. His primary responsibilities were in the management of R&D projects in solid-state image sensors. From 1997 to 2004 he worked at CSEM, first as a Project Manager and then as the Section Head of the Image Sensing Group. Since 2004 he is heading CSEM’s Photonics Division in Zurich. Nicolas Blanc and his team won several awards, the most renown being the “EuroCase IST Grand Prize 2004” (€ 200’000) for the development of miniaturized 3D cameras for high performance and mass-market applications. Nicolas Blanc is member of the IEEE and SPIE, and board member of the association sensors.ch. He has co-authored more than 50 papers and 2 book chapters.

Stephan Beer, received his PhD in 2006 from the University of Neuchâtel, Switzerland, for “Real-time photon-noise limited optical coherence tomography based on pixel-level analogue signal processing”, a research project he carried out at the CSEM SA. In 2006 he joined CSEM’s Photonics Division to work as R&D engineer in several projects in the field of image sensing, especially smart-pixel imagers, high-speed, and low-noise imaging. Since 2010 he is the deputy of the head of the image sensing group at CSEM and responsible of the design activities in the field of image sensors.

André Bischof, received his M.S degree in 1996 from the Swiss Federal Institute of Technology (ETH Zurich), Switzerland. From 1996 to 1998, he worked with Philips Semiconductors in Zurich as a design engineer responsible for the design of VLSI circuits for telecom applications. In 1998, he joined Conexant Systems in Newport Beach, California, where he focused on the design of key signal processing circuits for personal communication products. From 2000 to 2005, he worked as a project leader at BridgeCo AG in Dübendorf, Switzerland. He was leading the product development of System On Chip (SoC) ASICs for multimedia products with first time success story and followed companion devices. In 2005, he joined G-Lab GmbH in Zurich, Switzerland, where he took the technical lead for the development of the “Geneva Sound System” product family (all-in-one home stereo audio systems), and got promoted to chief technical officer (CTO). Since 2009, he is working at CSEM’s Photonic Division as a R&D engineer and project leader.

Contact

André Bischof Senior R&D Engineer
andre_bischof@csem.ch
T +41 44 497 1454
F +41 44 497 1400

IBM Haifa, and TeraTOP

Image via CrunchBase

 

General description

IBM Haifa labs: IBM has the world's largest IT research organization, with more than 3,000 scientists and engineers working at 8 labs in 6 countries. IBM invests more than $5 billion a year in R&D and is the world’s leader in patent filings. In aggregate, the company holds nearly 37,000 patents worldwide. The Haifa Research Lab (HRL) is the largest of the five IBM research labs outside the United States. Since it first opened as the IBM Scientific Center in 1972, the IBM Research Lab in Haifa has conducted decades of research that have been vital to IBM's success. R&D projects are being executed today in a wide spectrum of EE and computer science field including optimization technologies, and on chip mmWave silicon technologies. Since FP4, IBM HRL has participated and led numerous EUfunded projects and is considered an Israeli leader in FP participation. Five projects are currently coordinated by IBM: RESERVOIR and VISION Cloud (FP7 IP projects), +Spaces, ACSI and PINCETTE (FP7 STRePs).This is in addition to PROSYD, SAPIR SHADOWS and Modelware, FP6 projects successfully concluded in the last few years. The A&MS (Analog and Mixed Signal) group at HRL is involved in high frequency mm wave silicon design as well as in the development of advanced tools for support of analog and RF design. The group is focused on three areas of expertise: The first being on chip interconnects modeling, developing high precision EM models for interconnects on chip applicable in the range of DC to over 100GHz. The second activity is in the development of an automated analog design migration tool for transfer of designs between technologies in which an efficient tool was developed and patented. The third activity is in the area of millimeter wave Silicon design for wireless communication systems and imaging.

Role / activity in the project

IBM H will lead the specification WP (WP1), and will contribute to the design, modelling and simulation of the THz electromagnetic part of the design – namely design of the part which guides the THz radiation till it is fully converted into heat in the TeraMOS detecting transistor (WP3).

People involved in the project

Danny Elad, PhD, received his PhD from the Dept. of Reliability and Quality Insurance, Technion, Israel Institute of Technology and has more than twenty years of experience in the microwave field. He has been instrumental in developing various microwave components in different technologies such as MIC, MMIC, Waveguide and others including Amplifiers, VCO's, Mixers, Frequency multipliers and more, designing and developing subsystems for various applications such as Wide band and Low phase noise VCO for Synthesizers, T/R modules for Communication and Radar, Wide band FMCW detector and more. Previous experience includes a term at HP (Now Agilent), where he developed an LMDS module for the Ka Band, and at Rafael, Israel, where he served as Microwave Integration Group Leader and Advanced Packaging Researcher.
Benny Sheinman, PhD, is a researcher in the mmWave, analog mixed-signal group at the IBM HRL He received his Ph.D. degrees in Electrical Engineering from the Technion-Israel Institute of Technology, Haifa, Israel, in 2003 with the dissertation topic “Electrical and Optical Properties of InP/GaInAs Heterojunction Bipolar Transistors for Digital Microwave Applications”. He has led the development of the analog migration tool for which he received an "IBM Innovation Award” . He is currently involved in the components design for a SiGe mmWave on-chip transceiver solution. He has taught multiple courses at the Technion, and is the author of many professional publications.
Evgeny Shumakher, PhD, is a researcher in the mmWave, analog mixed-signal group at the IBM HRL. He received the B.Sc., M.Sc. and Ph.D. degrees in Electrical Engineering from the Technion- Israel Institute of Technology, Haifa, Israel, in 2002, 2004 and 2010 respectively. He has worked for Intel (1999-2002) where he developed advanced digital circuits for the MPG and later for RAFAEL (2004-2007) where he was engaged in several project involving advanced mm-wave systems design for communication and radar applications. Currently, Evgeny also holds a lecturer position at the Technion EE dept. teaching "Introduction to Electrical Engineering". He is a recipient of numerous prestigious scholarships and awards, among which is the IEEE Photonic Society Graduate Student Fellowship awarded annually to 12 young scientists from all-over the globe for research excellence. He has over 30 publications in various journals and conference proceedings, and has co-authored one book chapter

TeraTOP-Terahertz Photonic Imager on Chip: Focus on Technion

My Note: I'm going to post some of the web information on the EU, IBM, Israeli, Terahertz Consortium, TeraTOP, from time to time, starting with Technion

http://www.teratop.eu/Technion_Info.html

Technion

General description

Technion – Israel Institute of Technology (IIT) is the first and largest Technical Institute in Israel and ranks among the top of its kind in the world. Since its founding, the institute has educated three generations of men and women who have played a key role in laying the country’s infrastructure and establishing its crucial defence and high-tech industries (~80,000 graduates). Boasting multiple Nobel Laureates, the IIT is a leader in scientific advancement and is at the forefront of the global network of science and technology. It has about 18 faculties, 40 research centres, 11 research institutes and 10 Centres of Excellence. It is located in a large campus, with ~100 buildings and state-of-the-art laboratories. The IIT also participates in many of the EU specific programs, such as BRITE-EURAM, JOULE, LIFE, ESPRIT FAIR, INCO, INNOVATION, COST, and INTAS.

The Department of Electrical Engineering of the IIT is ranked among the "top 10" Electrical Engineering and Computer Science departments in the world. The department is the major source of engineers who lead the development of advanced Israeli technology in the fields of electronics, computers and communications. The department acts as a center of excellence in applied and theoretical research, contributing to the advancement of knowledge in electrical and computer engineering in Israel and throughout the world. The department has extensive relations with industry as well as academic and industrial special liaison support programs.

Role / activity in the project

IIT will contribute to scientific and technical management of the project (WP1) and to the design, modelling and simulation of theTHz sensor – namely the TeraTOP detecting transistor(s) and the MEMS post processing of the TeraTOP Focal Plane Array. (WP2 & WP3).

People involved in the project

Yael Nemirovsky, is an IEEE Fellow as well as IEE Fellow and is a tenured full professor of the Faculty of Electrical Engineering at IIT- Israel Institute of Technology. Nemirovsky had been extensively involved in cooled and uncooled IRFPAs (infra Red Focal Plane Arrays) for security and medical imaging. She has been a principal investigator in large funded research programs that ended in prototype infrared detectors and systems that were transferred to industry. She was extensively involved in the CMOS technology as well as in CMOS Image Sensors. Nemirovsky is a pioneer of Micro-Electro-Mechanical Systems (MEMS) research in Israel and in the last decade her research has focused on Micro-Opto-Electro-Mechanical (MOEMS) Systems. Her current main focus is on CMOSSOI- MEMS and system-on-chip approach. Nemirovsky is the recipient of an Israeli national award: "The Award for the Security of Israel" and IIT awards for "Best Teacher" and "Novel Applied Research". She also received the Kidron Foundation award for "Innovative Applied Research" and the USA R&D 100 2001 award recognizing the top 100 new inventions and products of the year in USA. In 2000 she received Intel award and she is the recipient of the 2008 IBM faculty award. Nemirovsky co-authored ~180 papers to referred journals, several hundreds of conference papers and 23 patents.

Sara Stolyarova, PhD, is a senior IIT researcher, with a rank equivalent to associate professor in the esteemed national Israeli program KAMEA. She received her M.Sc. in Physics from Moscow State University, Russia and a Ph.D in Solid State Physics from the Institute of Physics, Academy of Sciences Latvia where she worked as a senior researcher in 1973-1992. Since 1995, she is a senior researcher in the IIT - Israel Institute of Technology, Haifa, collaborating with the Nemirovsky group. Her current research focuses on new microfabrication technologies based on CMOS-SOI-MEMS for sensors and solar cells.

Igor Brouk, PhD, received the electronic engineer degree (with honors) from the Moscow Institute of Aircraft Technology, in 1990, the M.Sc. degree in electrical engineering and the Ph.D. degree from the Technion—Israel Institute of Technology, Haifa, Israel, in 2000 and 2005, respectively. His research interests include CMOS photodiodes, image sensors, low noise analog readout, ion-sensitive FETs (ISFETs), RF, and analog electronics in VLSI.

Alex Svetlitza is a graduate student under professor Nemirovsky supervision. His PHD thesis focuses on CMOS-SOI-MEMS Thermal Antennas for passive imaging in THz range.

Contact

Yael Nemirovsky
nemirov@ee.technion.ac.il
T +972-4-8294688
F +972-4-8295757
Department of Electrical Engineering
Technion, Israel Institute of Technology
Room 709 Meyer Building
Technion City, Haifa 32000
ISRAEL
www.ee.technion.ac.il/Sites/People/YaelNemirovsky/

Dots » European project TeraTOP on track to develop THz passive imaging sensor

• http://networkedblogs.com/qHG7r

The TeraTOP project’s main objective is to develop a device that has the potential to reduce the cost and improve the capability of terahertz (THz) imaging in a wide range of applications including public security. A consortium of eight European industrial research groups and companies, TeraTOP focuses on potential security applications and will demonstrate a camera for detecting hidden objects.
Complimentary Metal-Oxide Semi-conductor (CMOS) technology has recently seen a vast development effort in the higher frequency regimes of the near-infrared and the visible parts of the spectrum. The resulting technology has generated substantial business volumes – in excess of €4bn in 2009 at the component level alone. The development of an analogous capability for the THz range currently relies on exotic materials and technologies and has been impeded by the lack of devices and circuits suitable for mass production. The consortium plans to implement a completely new type of THz sensor based on thermally isolated nanotransistors directly integrated with CMOS-SOI (Silicon On Insulator) readout circuitry. The THz region of the electromagnetic spectrum is attracting increasing attention from scientists around the world. Extending from the microwave- to the infrared region, this non-ionizing (and therefore safe) radiation can be used to see beneath outer layers of packaging and clothing.
The key target of the project is to make breakthrough advances in the functionality, performance, cost, and size of a passive THz camera. The target technology is a room temperature real-time imaging sys-tem based on CMOS batch manufacturing processes which are suitable for mass production. Success depends on the effective combination of several leading technologies from the broad scientific back-ground represented by the consortium’s members. The key enabling building blocks include: THz pho-tonic components, THz antennas, CMOS-SOI, NEMS, and frequency-selection technologies from the astronomy community.
TeraTOP intends to build on the valuable heritage of knowledge and experience gained during previous projects. Infrared imaging sensors based on CMOS-SOI-MEMS technology have been developed before. However, significant advances are to be expected from this new initiative if the TeraTOP team is to achieve its ambitious goals. Underlying the project are several important THz related patents and patent applications submitted by two of the project partners: Technion – Israel Institute of Technology – and IBM Haifa Labs. The TeraTOP project hopes for a significant product that can be implemented rapidly on a broad scale across Europe for the benefit of its citizens.
The project is funded by the European Commission’s 7th framework and has a total budget of €3.15M. It is led by Dr. Nicolas Blanc of CSEM (Switzerland). The consortium consists of: CSEM (Switzerland), Technion Israel Institute of Technology (Israel), IBM Haifa Research Lab (Israel), IBM Research GmbH (Switzer-land), CEA-LETI (France), the University of Wuppertal (Germany), EADS Deutschland GmbH (Germany), and QMC Instruments Ltd. (UK). Additional leading experts in the field of THz technology will form an external advisory board to assist the consortium.
Visit TeraTOP at www.teratop.eu.
Source: EE Times.