Chan Zheng; Zheyu Song; Shihan Yan; Jingbo Liu; Dongxiong Ling; Dongshan Wei; Jinyun Zhou
https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11441/114410D/Enhanced-terahertz-imaging-of-electronic-packaging-materials-with-deconvolution-algorithm/10.1117/12.2547637.short
This paper proposes the deconvolution image
restoration algorithm, which uses the point spread function constructed by the
physical characteristics of the terahertz beam to reconstruct the terahertz
image and improve the image resolution[1]. At the same time, by constructing a
point spread function with different penetration depths in the sample, the
effect of image chromatogram on the sample can also be achieved. The integrated
circuit (IC) electronic package terahertz imaging results clearly show the spatial
position of the pins, internal chips and defects of the electronic packages,
and analyze a variety of failure defect types, which are <1% more than the
actual size.
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