US Patent-Thickness determination and layer characterization using terahertz scanning reflectometry

United States Patent 9909986
Inventors:
Rahman, Anis (Hummelstown, PA, US) 
Rahman, Aunik K. (Hummelstown, PA, US) 

http://www.freepatentsonline.com/9909986.html


A terahertz scanning reflectometer system is described herein for in-situ measurement of polymer coating thickness, semiconductor wafer's surface sub-surface inspection in a non-destructive and non-invasive fashion with very high resolution (e.g., 25 nm or lower) and spectral profiling and imaging of surface and sub-surface of biological tissues (e.g., skin) in a non-invasive fashion