US Patent-Thickness determination and layer characterization using terahertz scanning reflectometry

United States Patent 9909986
Inventors:
Rahman, Anis (Hummelstown, PA, US) 
Rahman, Aunik K. (Hummelstown, PA, US) 

http://www.freepatentsonline.com/9909986.html


A terahertz scanning reflectometer system is described herein for in-situ measurement of polymer coating thickness, semiconductor wafer's surface sub-surface inspection in a non-destructive and non-invasive fashion with very high resolution (e.g., 25 nm or lower) and spectral profiling and imaging of surface and sub-surface of biological tissues (e.g., skin) in a non-invasive fashion

Abstract-Terahertz scanning reflectometer

United States Patent 9239290

Inventors:

Rahman, Anis (Hummelstown, PA, US) 

Rahman, Aunik K. (Hummelstown, PA, US
http://www.freepatentsonline.com/9239290.html

A terahertz scanning reflectometer is described herein. A high sensitivity terahertz scanning reflectometer is used to measure dynamic surface deformation and delamination characteristics in real-time. A number of crucial parameters can be extracted from the reflectance measurements such as dynamic deformation, propagation velocity, and final relaxation position. A terahertz reflectometer and spectrometer are used to determine the permeation kinetics and concentration profile of active ingredients in stratum corneum.