Speaker Dr. Shang Yang, PhD
Company Advantest (SINGAPORE) Pte Ltd
Designation Senior R&D and Application Engineer
The chip technology is guided by Moore’s law for the past few decades. As the 2-dimension scaling of transistors is gradually approaching its physical limitation, several new directions, such as 3-dimension IC (3D IC) and Opto-Electronic IC (OEIC), are proposed to follow and even transcend Moore’s law. As a result, several challenges are posed in the packaging technology, such as thermal management, reliability, and quality control,which ultimately impacts device performance.
In recent years, Terahertz (THz) time-domain spectroscopy (TDS) imaging method has received considerable attention as a promising non-destructive technique for a 3D tomography scanning. Compared to the other non-destructive imaging techniques such as X-ray, Microwave or SAT (scanning acoustic tomographic), THz-TDS imaging method has many advantages in terms of scanning speed, image resolution, system robustness as well as operation safeness. In this presentation, various applications of THz-TDS have been discussed in the latest IC packaging technologies; followed by the introduction of ADVANTEST TS9000 Chip Mold Thickness Analysis System which help redefines the limits of traditional IC package analysis.
SEMICON Southeast Asia 2015
