A repository & source of cutting edge news about emerging terahertz technology, it's commercialization & innovations in THz devices, quality control, process control, medical diagnostics, security, astronomy, communications, graphene, metamaterials, CMOS, compressive sensing, 3d printing, and the Internet of Nanothings. NOTHING POSTED IS INVESTMENT ADVICE! REPOSTED COPYRIGHT IS FOR EDUCATIONAL USE.
Tuesday, May 23, 2017
Abstract-Silicon-on-Insulator Substrates as a Micromachining Platform for Advanced Terahertz Circuits
N. Scott Barker; Matthew Bauwens; Arthur Lichtenb erger; Robert Weikle http://ieeexplore.ieee.org/document/7725958/ This paper presents a comprehensive overview of the development and utilization of a micromachined silicon-on-insulator (SOI) fabrication process that has enabled the development of terahertz (THz) frequency superconducting-insulator-superconducting (SIS) and hot-electron bolometer (HEB) mixers, broadband directional couplers, on-wafer probes, as well as several multipliers. Through the detailed presentation of these circuits, it is demonstrated that ultrathin silicon is able to provide the required characteristics to enable the heterogeneous integration of multiple device technologies that is likely to be required for future THz system-on-chip (T-SoC) development.