Thursday, May 25, 2017

Abstract-Interconnect and packaging technologies for terahertz communication systems

Goutam Chattopadhyay, Theodore Reck,  Cecile Jung-Kubiak,   Maria Alonso-delPino, 
Choonsup Lee

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.

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