A repository & source of cutting edge news about emerging terahertz technology, it's commercialization & innovations in THz devices, quality & process control, medical diagnostics, security, astronomy, communications, applications in graphene, metamaterials, CMOS, compressive sensing, 3d printing, and the Internet of Nanothings. NOTHING POSTED IS INVESTMENT ADVICE! REPOSTED COPYRIGHT IS FOR EDUCATIONAL USE.
Showing posts with label Yuan Liang. Show all posts
Showing posts with label Yuan Liang. Show all posts
Friday, July 22, 2016
Abstract-On-chip sub-terahertz surface plasmon polariton transmission lines with mode converter in CMOS
Anak Agung, Alit Apriyana,, Hao Yu, Jincai Wen, Nan Li, Yu Luo, Lingling Sun, Yuan Liang,
http://www.nature.com/articles/srep30063
An on-chip low-loss and high conversion efficiency plasmonic waveguide converter is demonstrated at sub-THz in CMOS. By introducing a subwavelength periodic corrugated structure onto the transmission line (T-line) implemented by a top-layer metal, surface plasmon polaritons (SPP) are established to propagate signals with strongly localized surface-wave. To match both impedance and momentum of other on-chip components with TEM-wave propagation, a mode converter structure featured by a smooth bridge between the Ground coplanar waveguide (GCPW) with 50 Ω impedance and SPP T-line is proposed. To further reduce area, the converter is ultimately simplified to a gradual increment of groove with smooth gradient. The proposed SPP T-lines with the converter is designed and fabricated in the standard 65 nm CMOS process. Both near-field simulation and measurement results show excellent conversion efficiency from quasi-TEM to SPP modes in a broadband frequency range. The converter achieves wideband impedance matching (<−9 dB) with excellent transmission efficiency (averagely −1.9 dB) from 110 GHz–325 GHz. The demonstrated compact and wideband SPP T-lines with mode converter have shown great potentials to replace existing waveguides as future on-chip THz interconnects. To the best of the author’s knowledge, this is the first time to demonstrate the (sub)-THz surface mode conversion on-chip in CMOS technology.
Saturday, October 10, 2015
Abstract-On-chip sub-terahertz surface plasmon polariton transmission lines in CMOS
http://www.nature.com/articles/srep14853
A low-loss and low-crosstalk surface-wave transmission line (T-line) is demonstrated at sub-THz in CMOS. By introducing periodical sub-wavelength structures onto the metal transmission line, surface plasmon polaritons (SPP) are excited and propagate signals via a strongly localized surface wave. Two coupled SPP T-lines and two quasi-TEM T-lines are both fabricated on-chip, each with a separation distance of 2.4 μm using standard 65 nm CMOS technology. Measurement results show that the SPP T-lines achieve wideband reflection coefficient lower than −14 dB and crosstalk ratio better than −24 dB, which is 19 dB lower on average than the traditional T-lines from 220 GHz to 325 GHz. The demonstrated compact and wideband SPP T-lines have shown great potential for future realization of highly dense on-chip sub-THz communications in CMOS.
A low-loss and low-crosstalk surface-wave transmission line (T-line) is demonstrated at sub-THz in CMOS. By introducing periodical sub-wavelength structures onto the metal transmission line, surface plasmon polaritons (SPP) are excited and propagate signals via a strongly localized surface wave. Two coupled SPP T-lines and two quasi-TEM T-lines are both fabricated on-chip, each with a separation distance of 2.4 μm using standard 65 nm CMOS technology. Measurement results show that the SPP T-lines achieve wideband reflection coefficient lower than −14 dB and crosstalk ratio better than −24 dB, which is 19 dB lower on average than the traditional T-lines from 220 GHz to 325 GHz. The demonstrated compact and wideband SPP T-lines have shown great potential for future realization of highly dense on-chip sub-THz communications in CMOS.
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