A repository & source of cutting edge news about emerging terahertz technology, it's commercialization & innovations in scanners, quality control, process control, medical diagnostics, security, astronomy,communications, graphene, metamaterials, CMOS, compressive sensing,3d printing, and the Internet of Everything. NOTHING POSTED IS INVESTMENT ADVICE! REPOSTED COPYRIGHT IS FOR EDUCATIONAL USE. I am a private investor in THz.
Tuesday, October 11, 2016
Abstract-Terahertz Sub-Nanometer Sub-Surface Imaging of 2D Materials
Rahman A1*, Rahman AK1, Yamamoto T2 and Kitagawa H2
1Applied Research and Photonics, Friendship Road, Harrisburg, United States
2Graduate School of Science, Kyoto University, Kyoto-fu, Japan
Anis Rahman Applied Research and Photonics, 470 Friendship Road, Suite 10 Harrisburg, PA 17111, United States Tel: +1-717-623-8201 E-mail: email@example.com
Terahertz sub-surface imaging offers an effective solution for surface and 3D imaging because of minimal sample preparation requirements and its ability to “see” below the surface. Another important property is the ability to inspect on a layer-by layer basis via a non-contact route, non-destructive route. Terahertz 3D imager designed at Applied Research and Photonics (Harrisburg, PA) has been used to demonstrate reconstructive imaging with a resolution of less than a nanometer. Gridding with inverse distance to power equations has been described for 3D image formation. A continuous wave terahertz source derived from dendrimer dipole excitation has been used for reflection mode scanning in the three orthogonal directions. Both 2D and 3D images are generated for the analysis of silver iodide quantum dots’ size parameter. Layer by layer image analysis has been outlined. Graphical analysis was used for particle size and layer thickness determinations. The demonstrated results of quantum dot particle size checks well with those determined by TEM micrograph and powder X-ray diffraction analysis. The reported non-contact measurement system is expected to be useful for characterizing 2D and 3D naomaterials as well as for process development and/or quality inspection at the production line.