TOKYO —
The devices use time-domain reflectometry (TDR) and time-domain transmissometry (TDT) measurement technology to pinpoint and map circuit defects using short-pulse signal processing. The solution delivers circuit analysis with high spatial precision of <5 μm, and a maximum measurement range of 300 mm in TDR configuration or 600 mm in TDT configuration, including for internal circuitry used in through-silicon vias and interposers.
The optional data link locates, maps and displays errors on the CAD data of the target device.
No comments:
Post a Comment