M Casellea, M Balzera, S Chilingaryana, M Hofherrb, V Judinc, A Kopmanna, N J Smaled, P Thomab, S Wuenschb, A -S Müllerc, M Siegelb and M Webera
http://iopscience.iop.org/1748-0221/9/01/C01024
a IPE Department — Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
b IMS Department — Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
c LAS Department — Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
d ANKA Facility Department — Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
b IMS Department — Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
c LAS Department — Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
d ANKA Facility Department — Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany
The recording of coherent synchrotron radiation requires data acquisition systems with a temporal resolution of tens of picosecond. This paper describes a new real-time and high-accuracy data acquisition system suitable for recording individual ultra-short pulses generated by a fast terahertz (THz) detector (e.g. YBCO, NbN, Zero Biased Schottky Diode). The system consists of a fast sampling board combined with a high data throughput readout. The first board is designed for sampling the fast pulse signals with a full width half maximum (FWHM) between a few tens to one hundred picoseconds with a minimum sampling time of 3 ps. The high data throughput board consists of a PCIe-Bus Master DMA architecture used for fast data transfer up to 3 GByte/s. The full readout chain with fast THz detectors and the acquisition system has been successfully tested at the synchrotron ANKA. An overview of the electronics system and preliminary results with multi-bunch filling pattern will be presented.
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