TeraView Signs Agreement with Hermes-Epitek

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TeraView is pleased to announce that it has signed an agreement with Hermes-Epitek for the sales and service of its advanced semiconductor packaging inspection tool in Taiwan, People’s Republic of China, Singapore and Malaysia.

On the back of strong demand for its fault isolation and quality assurance product in advanced integrated circuits, TeraView is pleased to announce that it has signed a collaborative sales and service agreement with Hermes – Epitek to sell and support this product in Taiwan, People’s Republic of China, Singapore and Malaysia.

Hermes, with around 1100 employees and 13 offices across the region, is one of the largest equipment distributors in the semiconductor industry and has long been recognized for its excellence in superior customer satisfaction.

TeraView and Hermes have already qualified interest from several leading semiconductor and IC packaging companies in the region, and will now work together to provide demonstration and front-line support facilities, as well as joint marketing of the tool to customers.

TeraView’s proprietary Electro Optical Terahertz Pulse Reflectometry (EOTPR) technology provides a 10 micron resolution capability in isolating faults within advanced integrated circuits for mobile phones and computing, including complex wire-bonded, flip chip, and 3D packages. Intel has worked alongside TeraView in the development of the technology, and formally announced the tool to the semiconductor market at the ECTC Conference in Las Vegas in June 2010.

“We are very pleased with the high level of interest in the product in Asia and are gearing ourselves up to support our customers” said Don Arnone, CEO of TeraView. “Clearly Asia will be a key market for the product, and with Hermes as our partner, we feel well-placed to maximise its potential whilst also meeting the exacting support and service requirements of our customers. This will be the start of a long relationship as we look to build a strong presence within the Asian semiconductor and IC packaging inspection market.”