Showing posts with label AMO GmbH. Show all posts
Showing posts with label AMO GmbH. Show all posts

Saturday, March 22, 2014

Terahertz MicroNano Technology blog -BIMETALLIC GRATING STRUCTURES – A new concept for large-scale bias-free terahertz emitters



http://amoprotemics.wordpress.com/2014/01/28/bimetallic-grating-structures-a-new-concept-for-large-scale-bias-free-terahertz-emitters/


Fig. 1
Fig. 1: (top) Top-view showing both investigated lateral schemes of the fabricated radial mode Terahertz emitter structures featuring complementary bimetal/semiconductor sequences. (bottom) Cross-section view of device including the principle THz field distribution after optical excitation.
A new concept for the optical generation of THz radiation has been introduced by AMO GmbH, Germany. The approach – filed for patent application [1] by the company – uses grating structures made of two different metal materials which are configured on a semiconducting substrate. THz pulse generation is triggered by optical excitation of this structure through femtosecond near-infrared pulses and subsequent acceleration of the photo-induced charge-carriers. Scaling of the actively emitting areas into a range of square-mm sizes (helpful to avoid conversion efficiency degradation through pump saturation effects) is straightforward.
Earlier large-scale THz emitter concepts used voltage-biased metal-semiconductor-metal (MSM)-structures [2,3]. For these structures increasing emitter area means an increasing probability for device fade-out through a single short-cut defect. Now, the emitter is operated bias-free because inherent Schottky-fields present at the bimetallic/semiconductor interfaces are used for charge-carrier acceleration. As a result, the emitter stays functionally unimpaired even in case of short-cut defects.

Bias-free Terahertz emission – Schottky-field vs. photo-Dember

The introduced emitter is sharing this robustness with an earlier bias-free THz emitter concept based on lateral photo-Dember field induction [4], but it features the important further advantages of simple monolithic fabrication and higher efficiency. In order to generate lateral photo-Dember fields the fabrication of (mono-) metallic gratings with three-dimensional wedged profiles is required. These profiles are difficult to realize for arbitrary shaped gratings like radial or curved ones instead of shown linear gratings. More important, lateral charge carrier acceleration through Schottky-fields is not limited to semiconductor materials with pronounces differences in electron and hole mobilities and diffusion processes (as used for photo-Dember field induction). Consequently, the new approach enables bias-free Terahertz emitters with improved efficiency. A demonstration device in terms of a radial mode THz emitter has now been presented using the new bimetal grating concept.

No bimetal, no Terahertz emission

The key feature enabling Terahertz generation within the novel large-scale grating structure is based on the application of two different metal materials: While the lateral Schottky-fields in a monometallic grating always cancel out over a full grating area, there is a net lateral field at bimetallic gratings resulting from the Schottky-field difference between both metals applied. Fig. 1 (top) is showing the principle configuration of the investigated radial grating emitter. By choosing the medial sequential order of the applied metals (e.g. metal 1/metal 2/semiconductor instead of metal 2/metal 1/semiconductor) it is possible to flip the direction of the generated THz field by 180° as shown in the cross-section view at the bottom of Fig. 1. A representative surface-profile is shown in Fig. 2. Three height levels visible in this plot correspond to plateau areas representing the bare semiconductor surface (dark green), metal 1 or metal 2 (light green) and metal 1/metal 2 one above the other (yellow). No wedged structures have been formed in this case.
Fig. 2
Fig. 2: Surface-profile measurement of the center region of a radial bimetal grating emitter.

Advanced monitoring of THz near-field emission

The THz emission process has been measured using photoconductive microprobes (from the TeraSpike TD-800 series) developed in-house through AMO. The probes allow the selective time-domain sampling of every THz vector-field component in x-, y- and z-direction in terms of amplitude and phase. Fig. 3 is showing a single snap-shot of the field amplitude distribution in z-direction measured shortly after optical excitation at a pair of radial emitters. The measurement plane is on the emitter backside as sketched by the dashed red line in Fig. 1. As expected for the z-component of a radial mode, the largest field magnitudes are observed at the center of each emitter. Both emitters have been fabricated using the converse bimetal sequences also illustrated in Fig. 1. As a consequence, the field lines on both radial emitters are pointing in opposite direction which confirms that the Schottky-field induced THz generation is working as expected. A movie showing the time evolution of the excitation process can be watched by following the link in the caption of Fig. 3.
Fig. 3: Measurement of the z-component of the Terahertz near-field distribution shortly after optical excitation. To watch a movie showing the full time-domain excitation process click here.
Fig. 3: Measurement of the z-component of the Terahertz near-field distribution shortly after optical excitation. To watch a movie showing the full time-domain excitation process click here.

Conclusion

Bimetallic grating structures are highly attractive for the production of bias-free large-scale THz emitters of arbitrary shape and size. The given example of a radial-mode emitter demonstrates the flexibility of this approach very nicely. Further important attributes are robustness and efficiency. In addition to pulsed generation the concept should also be attractive for continuous wave (cw) Terahertz signal generation [5] using semiconducting materials with sufficiently short carrier lifetimes.

References:

[1] M. Nagel, German patent application, DE 102012010926 A1
[2] A. Dreyhaupt et al., Appl. Phys. Lett. 86, 121114 (2005),http://dx.doi.org/10.1063/1.1891304
[3] M. Awad et al., Appl. Phys. Lett. 91, 181124 (2007); http://dx.doi.org/10.1063/1.2800885
[4] G. Klatt et al., Optics Express, Vol. 18, Issue 5, pp. 4939-4947 (2010),http://dx.doi.org/10.1364/OE.18.004939

Wednesday, December 11, 2013

AMO GmbH - Launch of new TeraSpike microprobe model TD-800-Z-A-500G.

http://www.amo.de/?id=798&L=2

TeraSpike - LT-GaAs photoconductive field detector

With the new device series TeraSpike we proudly introduce the next generation of microprobes for the photoconductive detection of electric fields in the THz frequency range. Based on our customers’ feedback and growing application-driven demands a thorough re-design of our previous near-field probe-tip has been developed. The result is a versatile detector for radiated and surface-near electric fields in the THz-range with unprecedented performance, robustness and applicability. It seamlessly fits into THz time-domain systems with optical excitation wavelengths below 860 nm and is the most cost-efficient solution to turn your system into a powerful high-resolution near-field THz system.

Your laser-based THz system can do much more than just spectroscopy – discover the fascinating world of high-resolution THz applications!

Key features

  • Smallest active THz probe-tip on the market with only 1 µm cantilever thickness based on a patented design (DE 10 2009 000 823.3)
  • Spatial resolution up to 3 µm
  • Frequency range 0-4 THz
  • Adaptable to all laser-based THz-Systems with λ < 860 nm
  • Mounting compatible with standard opto-mechanical components
  • Typical optical excitation power with common fs-lasers 1-5 mW (1-5 µJ/cm²)

Applications

  • Terahertz research:  Metamaterials, plasmonics, graphene, waveguides, …
  • High-resolution Terahertz near-field imaging
  • Contact-free sheet resistance imaging of semiconductors
  • MMIC device characterization
  • Non-destructive chip inspection
  • Time-domain reflectometry (TDR)
Measured near-field distribution of a gated graphene layer.
Measured near-field distribution of a gated graphene layer on SiO2-Si revealing conductivity inhomogeneity.
THz near-field image of a metamaterial surface.
Measured near-field image of a pulse-excited THz metamaterial surface.
Sheet conductivity image of a laser-doped mc-si wafer.
Measured sheet conductivity image of a laser-doped multicrystalline silicon wafer.
 
Further application examples can be found on our THz-Technology pages. 

Measurement services

AMO is also offering this innovative technology for measurement services on customer samples. Our advanced optoelectronic system with scanning speeds as high as 33 mm/s is able to provide crucial high-resolution conductivity information which is quasi inaccessible to existing measurement technology under cost and expenditure of time considerations.
For detailed information please refer to our service brochure or contact us directly.

Exemplary measurement set-up

The THz-Tip is mainly dedicated to be used in femtosecond pump probe experiments. The figure illustrates a typical set-up where the THz radiation transmitted through the sample is measured by the THz-Tip which is gated by the femtosecond probe beam.

 
Other configurations to measure in reflection or synchronized to HF devices in near-field are possible as well.
Best results, for fast transient recording, are obtained using a fast sampling technique like AMO´s AixScantechnology utilising shakers, ASOPS or ECOPS as a faster alternative to lock-in amplifiers with superior noise reduction also for low frequency noise.

Technical Data

AMO currently offers four different versions of near-field probes: The three probes from the X-series are sensitive to transversal THz field components. The new Z-series is sensitive to longitudinal THz field components. Within the X-series the HR-type is designed to provide highest spatial resolution while the HS-type is optimized for high sensitivity. The HRS-type offers highest field sensitivity from 0.5 THz to 1.3 THz at considerably higher spatial resolution (20 µm) than the HS (100 µm). All microprobes are designed for pulsed excitation and are equipped with an overvoltage protection. Each probe is individually tested and comes with manual & certificate enclosed.

For further information please take a look at our brochure (PDF file, 2 MB).

TeraSpike TD-800-          X-HR             X-HRS            X-HS          Z-A-500G    
Max. spatial resolution3 µm20 µm100 µm8 µm
Photoconductive gap size at tip1.5 µm2 µm3 µm5 µm
Dark current @ 1V Bias< 0.5 nA< 0.5 nA< 0.4 nA< 0.4 nA
Photocurrent> 1 µA> 0.6 µA> 0.6 µA> 0.5 µA
Excitation wavelength700 nm ... 860 nm
Excitation power1 mW ... 4 mW
Connection typeSMP
Average power and photocurrent refer to a spot diameter 40 µm, bias voltage 1 V , average optical
excitation power 4 mW at a laser repetition rate of 80 MHz and approx. 100 fs pulse duration. 
 

Integration in existing measurement systems

The integration of the TeraSpike microprobe into an existing (far-field) set-up is very simple thanks to a versatile mounting compatible to standardized opto-mechanical components. As required by the application the orientation of the TeraSpike can be freely chosen. For fast and easy implementation mounting post, post-holder and connection cable are included with the TeraSpike Starter Kit. The cheap dummy probe-tip TeraSpike Phantom - also included in the starter kit -  is recommended to be applied during the mechanical set-up and construction work. Hence the risk of accidential mechanical impact during that process can be easily avoided. The probe is delivered in a robust transport and storage box.
With our opto-mechanical sub-system modules the integration of TeraSpike microprobes is further simplified. The core module D-B1 covers the functions of beam-to-tip alignment, focusing and probe-tip height variation. Module D-B2 is a vertical breadboard base holding the core module D-B1 as well as further beam guiding components. It is offering enough space for additional components such as a CCD camera for probe-tip monitoring or a distance sensor for the sampling of profiled or tilted sample surfaces.
The electrical connection is done through a small coaxial SMP plug. For the operation we recommend the use of a low-noise current amplifier with 107-108 V/A amplification (e.g. DLPCA200) and high-grade connection cables (e.g. our TS Cable).
Further information can be found in the TeraSpike brochure. Please do not hesitate to contact us if you have any questions or need technical advice. In addition to our standard components we are also offering the fabrication of customized microprobe designs for your individual needs.

Order Information

TeraSpike TD-800-  THz photoconductive probe-tip with SMP plug
        Options: TD-800-X-HRX-HSX-HRS or Z-A-500G
TeraSpike Phantom  Dummy probe-tip device
TS CableSMP to SMA/BNC probe connection cable
TeraSpike Starter KitContains one TeraSpike TD-800-(X-HR, X-HS, X-HRS or Z-A-500G),
TeraSpike Phantom,
TS Cable, mounting post and post holder
DLPCA-200Variable gain current amplifier
Sub-System D-B1Axial positioning, focusing, alignment unit
Sub-System D-B2Vertical board base unit including D-B1


Friday, August 30, 2013

From Terahertz MicroNano Technology "EMERGING TRANSPARENT CONDUCTORS – Advanced measurement tools needed"


                                                 Fig. 1: High-resolution sheet resistance image acquired
                                                                  at a metal mesh covered glass wafer fabricated through 
                                                                  Rolith, Inc
http://amoprotemics.wordpress.com/2013/08/

Following recent economic predictions the market for transparent conductor technologies excluding the yet standard material indium tin oxide (ITO) will see a significant increase from $206 million in 2013 to $4 billion by 2020 [1]. The applications requiring transparent conductors are manifold ranging from touch sensors, displays, lighting, thin-film solar cells to smart windows and others. Since ITO has deficits in terms of cost, mechanical flexibility and sheet resistance many companies like Atmel, Fujifilm, Cambrios, Rolith, Unipixel as well as research institutes are working on (and have already brought to market) alternative solutions such as graphene layers, silver nanowire dispersions or metal mesh nanostructures. Especially the latter approach appears to be very promising by offering superior conductivity, transparency and flexibility.However, the efficient development of non-ITO technologies also relies on the availability of powerful analysis tools. High-resolution measurements of sheet resistance distributions on large-scale areas, for example, have been a major problem so far and emerging transparent conductor technologies have even raised the analytic requirements. Metal mesh structures – typically consisting of sub-µm-wide wires – require time-consuming and destructive application of sufficiently large contact pad structures to enable contact based measurements. Existing contactless methods on the other hand (e.g. Eddy current based systems) are limited to only mm-scale spatial resolution – too low to visualize any local defects or inhomogeneity.
A new measurement tool recently developed by AMO GmbH, Germany, employing THz radiation in combination with the highly-resolving contactless microprobes (TeraSpike) [2]represents an important step towards the elimination of this lack. Offering quantitative sheet resistance measurements with up to 10 µm resolution the system has been applied recently to structured graphene layers from the Korean manufacturer Samsung Techwin[3]. Now the system has been used to demonstrate the prime performance of the metal mesh technology available from the Californian start-up company Rolith. Metal structures were fabricated in the form of submicron-width nanowires completely invisible to the human eye, lithographically placed in a regular 2-dimentional grid pattern with a period of tens of microns and thickness of a few hundreds of nanometers [4].
The highly detailed sheet resistance image (Fig. 1) acquired with the new THz microprobe scanner system from AMO using a scanning speed of 5 ms/Pixel reveals the low resistivity (<14 Ohm/☐) of the metal mesh fabricated by Rolith. Together with a transparency of >94% and very low haze (~2%) the manufacturer now considers his “technology above all major competition for ITO-alternative technologies” [4].
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